RXSY MX3.0 series 3.0mm pitch straight DIP wafer, board-side connector interface with 180-degree vertical through-hole mounting structure. Made of high-temperature resistant PA66 engineering plastic with phosphor copper tin-plated pins, offering excellent soldering performance, high mechanical strength and stable reliable contact. Single-row design supporting 2P to 12P pin counts, straight pin through-hole structure facilitates PCB soldering and high-density assembly. Widely used in power modules, industrial control motherboards, home appliance control boards and communication equipment. RoHS/REACH compliant, long mating life, direct replacement for JST MX3.0 series products.
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Model
RXSY-MX3.0-N*PZZ
Series
Rectangular Connector Series
Package Type
插件,P=2.5mm
Pitch
3.0mm
Product Specifications
Product Type
Wafer
Rated Current
5 AC/DC
Rated Voltage
250 AC/DC
Operating Temperature Range
-40°C~+85°C
Product Features
3.0mmPitch,Compact structure
Rated Current 5 AC/DC,High current carrying capacity
Rated Voltage 250 AC/DC
Operating Temperature Range -40°C~+85°C,Strong adaptability
mounting type:插件,P=2.5mm
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Datasheet (Datasheet)
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