RXSY MX3.0 series 3.0mm pitch vertical SMT wafer, board-side connector interface with vertical surface mount structure. Made of high-temperature resistant PA66 engineering plastic with phosphor copper tin-plated pins, offering excellent reflow soldering performance, high solder strength and stable contact. Single-row design supporting 2P to 12P pin counts, vertical installation saves PCB board space, compatible with MX3.0 series housings and terminals. Widely used in power modules, industrial control equipment, home appliance control boards and communication equipment. RoHS/REACH compliant, long mating life, stable and reliable quality.
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Model
RXSY-MX3.0-N*PLT
Series
Rectangular Connector Series
Package Type
SMD,P=2.5mm
Pitch
3.0mm
Product Specifications
Product Type
Wafer
Rated Current
5 AC/DC
Rated Voltage
250 AC/DC
Operating Temperature Range
-40°C~+85°C
Product Features
3.0mmPitch,Compact structure
Rated Current 5 AC/DC,High current carrying capacity
Rated Voltage 250 AC/DC
Operating Temperature Range -40°C~+85°C,Strong adaptability
mounting type:SMD,P=2.5mm
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Datasheet (Datasheet)
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